GB50809-2012：硅集成电路芯片工厂设计规范

GB50809-2012······1

1 总 则······11

2 术 语······12

3 工艺设计······14

3.1 一般规定······14

3.2 技术选择······14

3.3 工艺布局······14

4 总体设计······17

4.1 厂址选择······17

4.2 总体规划及布局······17

5 建筑与结构······18

5.1 建筑······18

5.2 结构······18

5.3 防火疏散······19

6 防微振······20

6.1 一般规定······20

6.2 结构······20

6.3 机械······21

7 冷热源······22

8 给排水及消防······24

8.1 一殷规定······24

8.2 给排水······24

8.3 消防······25

8.4 灭火器······27

9 电 气······28

9.1 供配电······28

9.2 照明······28

9.3 接地······29

9.4 防静电······29

9.5 通信与安全保护······30

9.6 电磁屏蔽······31

10 工艺相关系统······33

10.1 净化区······33

10.2 工艺排风······34

10.3 纯水······35

10.4 废水······37

10.5 工艺循环冷却水······37

10.6 大宗气体······38

10.7 干燥压缩空气······39

10.8 真空······40

10.9 特种气体······41

10.10 化学品······42

11 空间管理······45

12 环境安全卫生······47

本规范用词说明······48

引用标准名录······49

附:条文说明······51

1 总 则······55

3 工艺设计······56

3.1 一般规定······56

3.2 技术选择······56

3.3 工艺布局······57

4 总体设计······62

4.1 厂址选择······62

4.2 总体规划及布局······62

5 建筑与结构······63

5.1 建筑······63

5.2 结构······63

5.3 防火疏散······64

6 防微振······65

6.1 一般规定······65

6.2 结构······68

6.3 机械······68

7 冷热源······69

8 给排水及消防······70

8.1 一般规定······70

8.2 给排水······71

8.3 消防······72

8.4 灭火器······74

9 电 气······75

9.1 供配电······75

9.2 照明······75

9.5 通信与安全保护······75

10 工艺相关系统······77

10.1 净化区······77

10.2 工艺排风······81

10.4 废水······86

10.5 工艺循环冷却水······87

10.6 大宗气体······88

10.7 干燥压缩空气······89

10.9 特种气体······89

10.10 化学品······90

11 空间管理······93

12 环境安全卫生······94