GB51037-2014：微组装生产线工艺设备安装工程施工及验收规范

本规范共分8章和1个附录,主要技术内容包括:总则,术语,基本规定,低温共烧陶瓷及厚膜基板制造工艺设备安装、调试及试运行,薄膜基板制造工艺设备安装、调试及试运行,组装封装工艺设备安装、调试及试运行,工艺检测设备安装、调试及试运行,工程验收等。

GB51037-2014······1

1 总 则······13

2 术 语······14

3 基本规定······16

3.1 施工条件······16

3.2 设备开箱······17

3.3 设备搬运······17

3.4 设备安装······18

3.5 设备调试与试运行······19

4 低温共烧陶瓷及厚膜基板制造工艺设备安装、调试及试运行······21

4.1 一般规定······21

4.2 流延机······21

4.3 切片机······22

4.4 生瓷打孔机······22

4.5 激光打孔机······23

4.6 微孔填充机······24

4.7 丝网印刷机······25

4.8 叠片机······25

4.9 等静压层压机······27

4.10 热切机······27

4.11 低温共烧陶瓷烧结炉······28

4.12 厚膜烧结炉······29

4.13 激光调阻机······29

5 薄膜基板制造工艺设各安装、调试及试运行······30

5.1 一般规定······30

5.2 磁控溅射镀膜机······30

5.3 真空蒸发镀膜机······31

5.4 化学气相淀积系统······33

5.5 旋涂及热板系统······34

5.6 曝光机······35

5.7 显影台······36

5.8 反应离子刻蚀机······37

5.9 化学机械抛光机······38

6 组装封装工艺设备安装、调试及试运行······40

6.1 一般规定······40

6.2 芯片粘片机······40

6.3 芯片共晶焊机······41

6.4 共晶炉······41

6.5 引线键合机······42

6.6 倒装焊机······43

6.7 等离子清洗机······43

6.8 选择性涂覆机······44

6.9 平行缝焊机······44

6.10 储能焊机······45

6.11 激光焊机······46

7 工艺检测设备安装、调试及试运行······48

7.1 一般规定······48

7.2 飞针测试系统······48

7.3 声学扫描检测系统······49

7.4 3D光学测量仪······49

7.5 自动光学检查仪······50

7.6 激光测厚仪······50

7.7 X射线检查仪······51

7.8 芯片剪切力/引线拉力测试仪······51

8 工程验收······53

8.1 一般规定······53

8.2 交接验收······53

8.3 竣工验收······54

8.4 验收不合格的处置······55

附录A 微组装生产线工艺设备安装工程验收记录用表······56

本规范用词说明······61

引用标准名录······62

附：条文说明······63

1 总 则······67

3 基本规定······69

3.1 施工条件······69

3.2 设备开箱······69

3.3 设备搬运······70

3.4 设备安装······70

3.5 设备调试与试运行······72

4 低温共烧陶瓷及厚膜基板制造工艺设备安装、调试及试运行······74

4.1 一般规定······74

4.2 流延机······74

4.3 切片机······75

4.4 生瓷打孔机······75

4.5 激光打孔机······75

4.7 丝网印刷机······76

4.9 等静压层压机······76

4.11 低温共烧陶瓷烧结炉······77

4.12 厚膜烧结炉······77

4.13 激光调阻机······77

5 薄膜基板制造工艺设各安装、调试及试运行······78

5.1 一般规定······78

5.2 磁控溅射镀膜机······78

5.3 真空蒸发镀膜机······79

5.4 化学气相淀积系统······79

5.5 旋涂及热板系统······80

5.6 曝光机······80

5.7 显影台······80

5.8 反应离子刻蚀机······81

5.9 化学机械抛光机······81

6 组装封装工艺设备安装、调试及试运行······82

6.1 一般规定······82

6.2 芯片粘片机······82

6.3 芯片共晶焊机······83

6.4 共晶炉······83

6.5 引线键合机······83

6.6 倒装焊机······83

6.8 选择性涂覆机······84

6.9 平行缝焊机······84

6.11 激光焊机······84

7 工艺检测设备安装、调试及试运行······85

7.1 一般规定······85

7.2 飞针测试系统······85

7.3 声学扫描检测系统······85

7.6 激光测厚仪······86

7.7 X射线检查仪······86

8 工程验收······87

8.1 一般规定······87

8.2 交接验收······88

8.3 竣工验收······89

8.4 验收不合格的处置······89