GB51291-2018：共烧陶瓷混合电路基板厂设计标准

GB51291-2018······1

1 总则······13

2 术语······14

3 总体设计······15

3.1 一般规定······15

3.2 厂址选择与厂区总平面布局······16

4 基本工艺······17

4.1 一般规定······17

4.2 配料······17

4.3 混料······18

4.4 流延······19

4.5 切片······19

4.6 打孔······20

4.7 填孔······21

4.8 印刷······22

4.9 叠片······23

4.10 层压······23

4.11 热切······24

4.12 共烧······24

4.13 熟切······26

4.14 激光调阻······26

4.15 镀涂······27

4.16 飞针测试······28

5 工艺设备配置······29

5.1 一般规定······29

5.2 配料工艺设备······29

5.3 混料工艺设备······30

5.4 流延工艺设备······30

5.5 切片工艺设备······31

5.6 打孔工艺设备······32

5.7 填孔工艺设备······33

5.8 印刷工艺设备······33

5.9 片工艺设备······34

5.10 层压工艺设备······34

5.11 热切工艺设备······35

5.12 共烧工艺设备······36

5.13 熟切工艺设备······36

5.14 激光调阻工艺设备······38

5.15 镀涂工艺设备······38

5.16 飞针测试工艺设备······39

6 工艺设计······40

6.1 一般规定······40

6.2 工艺区划······41

6.3 工艺设备布置······42

7 建筑与结构······43

7.1 建筑······43

7.2 结构······44

8 公用设施及动力······45

8.1 空气净化与排风系统······45

8.2 给水排水······45

8.3 气体动力······46

9 电气设计······49

9.1 供电······49

9.2 照明、配电和自动控制······49

9.3 通信、信息······50

10 环境保护与安全······51

10.1 环境保护······51

10.2 安全······51

本标准用词说明······53

引用标准名录······54

附：条文说明······55

1 总则······59

3 总体设计······61

3.1 一般规定······61

4 基本工艺······62

4.1 一般规定······62

4.2 配料······62

4.3 混料······62

4.4 流延······63

4.6 打孔······64

4.7 填孔······64

4.8 印刷······64

4.9 叠片······65

4.10 层压······65

4.11 热切······66

4.12 共烧······66

4.13 熟切······67

4.14 激光调阻······67

4.15 镀涂······68

5 工艺设备配置······70

5.1 一般规定······70

5.3 混料工艺设备······70

5.4 流延工艺设备······70

5.6 打孔工艺设备······70

5.7 填孔工艺设备······71

5.8 印刷工艺设备······71

5.9 片工艺设备······71

5.11 热切工艺设备······71

5.12 共烧工艺设备······71

5.13 熟切工艺设备······72

5.14 激光调阻工艺设备······72

6 工艺设计······73

6.1 一般规定······73

7 建筑与结构······74

7.2 结构······75

8 公用设施及动力······76

8.1 空气净化与排风系统······76

8.3 气体动力······76

9 电气设计······77

9.2 照明、配电和自动控.制······77

9.3 通信、信息······77

10 环境保护与安全······78

10.1 环境保护······78