本规范共分8章和1个附录,主要技术内容包括:总则,术语,基本规定,低温共烧陶瓷及厚膜基板制造工艺设备安装、调试及试运行,薄膜基板制造工艺设备安装、调试及试运行,组装封装工艺设备安装、调试及试运行,工艺检测设备安装、调试及试运行,工程验收等。
GB51037-2014······1
1 总 则······13
2 术 语······14
3 基本规定······16
3.1 施工条件······16
3.2 设备开箱······17
3.3 设备搬运······17
3.4 设备安装······18
3.5 设备调试与试运行······19
4 低温共烧陶瓷及厚膜基板制造工艺设备安装、调试及试运行······21
4.1 一般规定······21
4.2 流延机······21
4.3 切片机······22
4.4 生瓷打孔机······22
4.5 激光打孔机······23
4.6 微孔填充机······24
4.7 丝网印刷机······25
4.8 叠片机······25
4.9 等静压层压机······27
4.10 热切机······27
4.11 低温共烧陶瓷烧结炉······28
4.12 厚膜烧结炉······29
4.13 激光调阻机······29
5 薄膜基板制造工艺设各安装、调试及试运行······30
5.1 一般规定······30
5.2 磁控溅射镀膜机······30
5.3 真空蒸发镀膜机······31
5.4 化学气相淀积系统······33
5.5 旋涂及热板系统······34
5.6 曝光机······35
5.7 显影台······36
5.8 反应离子刻蚀机······37
5.9 化学机械抛光机······38
6 组装封装工艺设备安装、调试及试运行······40
6.1 一般规定······40
6.2 芯片粘片机······40
6.3 芯片共晶焊机······41
6.4 共晶炉······41
6.5 引线键合机······42
6.6 倒装焊机······43
6.7 等离子清洗机······43
6.8 选择性涂覆机······44
6.9 平行缝焊机······44
6.10 储能焊机······45
6.11 激光焊机······46
7 工艺检测设备安装、调试及试运行······48
7.1 一般规定······48
7.2 飞针测试系统······48
7.3 声学扫描检测系统······49
7.4 3D光学测量仪······49
7.5 自动光学检查仪······50
7.6 激光测厚仪······50
7.7 X射线检查仪······51
7.8 芯片剪切力/引线拉力测试仪······51
8 工程验收······53
8.1 一般规定······53
8.2 交接验收······53
8.3 竣工验收······54
8.4 验收不合格的处置······55
附录A 微组装生产线工艺设备安装工程验收记录用表······56
本规范用词说明······61
引用标准名录······62
附：条文说明······63
1 总 则······67
3 基本规定······69
3.1 施工条件······69
3.2 设备开箱······69
3.3 设备搬运······70
3.4 设备安装······70
3.5 设备调试与试运行······72
4 低温共烧陶瓷及厚膜基板制造工艺设备安装、调试及试运行······74
4.1 一般规定······74
4.2 流延机······74
4.3 切片机······75
4.4 生瓷打孔机······75
4.5 激光打孔机······75
4.7 丝网印刷机······76
4.9 等静压层压机······76
4.11 低温共烧陶瓷烧结炉······77
4.12 厚膜烧结炉······77
4.13 激光调阻机······77
5 薄膜基板制造工艺设各安装、调试及试运行······78
5.1 一般规定······78
5.2 磁控溅射镀膜机······78
5.3 真空蒸发镀膜机······79
5.4 化学气相淀积系统······79
5.5 旋涂及热板系统······80
5.6 曝光机······80
5.7 显影台······80
5.8 反应离子刻蚀机······81
5.9 化学机械抛光机······81
6 组装封装工艺设备安装、调试及试运行······82
6.1 一般规定······82
6.2 芯片粘片机······82
6.3 芯片共晶焊机······83
6.4 共晶炉······83
6.5 引线键合机······83
6.6 倒装焊机······83
6.8 选择性涂覆机······84
6.9 平行缝焊机······84
6.11 激光焊机······84
7 工艺检测设备安装、调试及试运行······85
7.1 一般规定······85
7.2 飞针测试系统······85
7.3 声学扫描检测系统······85
7.6 激光测厚仪······86
7.7 X射线检查仪······86
8 工程验收······87
8.1 一般规定······87
8.2 交接验收······88
8.3 竣工验收······89
8.4 验收不合格的处置······89
